Effects of Minor Cu, Ni and Ag Additions on the Reactions Between Sn-Based Solders and Co Substrate
Crossref DOI link: https://doi.org/10.1007/s11837-019-03573-x
Published Online: 2019-07-01
Published Print: 2019-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Chao-hong http://orcid.org/0000-0002-4137-5584
Kuo, Chun-yi
Guo, Yu-bin
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (MOST 107-2221-E-194-016)
Text and Data Mining valid from 2019-07-01
Version of Record valid from 2019-07-01
Article History
Received: 7 April 2019
Accepted: 26 May 2019
First Online: 1 July 2019