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Solder Joint Lifetime Modeling Under Random Vibrational Load Collectives

Crossref DOI link: https://doi.org/10.1007/s11837-019-03947-1

Published Online: 2019-12-17

Published Print: 2020-02

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Maniar, Youssef https://orcid.org/0000-0003-3026-2274
Konstantin, Georg

Sharma, Anuj

Binkele, Peter

Schmauder, Siegfried
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Text and Data Mining valid from 2019-12-17

Version of Record valid from 2019-12-17
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Article History

Received: 21 July 2019

Accepted: 3 December 2019

First Online: 17 December 2019