Liquid-State Interfacial Reactions of Sn and Sn-Ag-Cu Solders with p-Type (Bi,Sb)2Te3 Thermoelectric Material
Crossref DOI link: https://doi.org/10.1007/s11837-020-04288-0
Published Online: 2020-07-27
Published Print: 2020-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Chao-hong http://orcid.org/0000-0002-4137-5584
Li, Mei-hau
Chiu, Chun-wei
Wang, Xin-He
Funding for this research was provided by:
Ministry of Science and Technology, Taiwan (108-2221-E-194-036)
Text and Data Mining valid from 2020-07-27
Version of Record valid from 2020-07-27
Article History
Received: 29 April 2020
Accepted: 5 July 2020
First Online: 27 July 2020