Effect of Low Bi Content on Reliability of Sn-Bi Alloy Joints Before and After Thermal Aging
Crossref DOI link: https://doi.org/10.1007/s11837-021-05146-3
Published Online: 2022-02-01
Published Print: 2022-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Nishikawa, Hiroshi http://orcid.org/0000-0002-4363-9520
Hirata, Yuki
Yang, Chih-han
Lin, Shih-kang
Text and Data Mining valid from 2022-02-01
Version of Record valid from 2022-02-01
Article History
Received: 7 October 2021
Accepted: 26 December 2021
First Online: 1 February 2022
Conflict of interest
: The authors declare that they have no conflict of interest.