Power Cycling Reliability with Temperature Deviation of Pressureless Silver Sintered Joint for Silicon Carbide Power Module
Crossref DOI link: https://doi.org/10.1007/s11837-024-06398-5
Published Online: 2024-02-08
Published Print: 2024-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Hong, Won Sik https://orcid.org/0000-0001-8398-177X
Kim, Mi Song
Text and Data Mining valid from 2024-02-08
Version of Record valid from 2024-02-08
Article History
Received: 11 November 2023
Accepted: 17 January 2024
First Online: 8 February 2024
Conflict of interest
: The authors declare that they have no conflict of interest.