Thermal characterization of solvent-free epoxy coatings by rheology and kinetics combined
Crossref DOI link: https://doi.org/10.1007/s11998-019-00248-9
Published Online: 2019-08-05
Published Print: 2020-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Weih Q. http://orcid.org/0000-0002-7251-1980
Text and Data Mining valid from 2019-08-05
Version of Record valid from 2019-08-05
Article History
First Online: 5 August 2019