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Role of an interface crack for the blistering mode of a stiff film on a compliant substrate

Published Online: 2021-11-16

Published Print: 2022-03

Authors

Gu, Peixia

Chen, Xuejun https://orcid.org/0000-0001-8592-2060
Funding

Funding for this research was provided by:

National Natural Science Foundation of China (51871023)

Fundamental Research Funds for the Central Universities (FRF-GF-19-021B)
License Information

Text and Data Mining valid from 2021-11-16

Version of Record valid from 2021-11-16
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Article History

Received: 20 March 2021

Revised: 3 September 2021

Accepted: 10 September 2021

First Online: 16 November 2021

Document is current