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An experimental-numeric approach to manufacture semiconductor wafer using thick copper front metallization

Crossref DOI link: https://doi.org/10.1007/s12008-020-00736-y

Published Online: 2020-10-27

Published Print: 2021-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Calabretta, Michele https://orcid.org/0000-0001-9322-182X
Sitta, Alessandro https://orcid.org/0000-0003-2394-0882
Oliveri, Salvatore Massimo https://orcid.org/0000-0002-2993-6975
Sequenzia, Gaetano https://orcid.org/0000-0002-6063-2830
Funding

Funding for this research was provided by:

Università degli Studi di Catania
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Text and Data Mining valid from 2020-10-27

Version of Record valid from 2020-10-27
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Article History

Received: 11 March 2020

Accepted: 6 October 2020

First Online: 27 October 2020