Study of electroless copper plating on ABS resin surface modified by heterocyclic organosilane self-assembled film
Crossref DOI link: https://doi.org/10.1007/s12034-014-0615-z
Published Online: 2014-04-16
Published Print: 2014-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
ZHANG, H N
WANG, J
SUN, F F
LIU, D
WANG, H Y
WANG, F
Text and Data Mining valid from 2014-02-01