Preparation of Cu nanoparticles by a pulsed wire evaporation process for conductive ink applications
Crossref DOI link: https://doi.org/10.1007/s12034-018-1725-9
Published Online: 2019-02-15
Published Print: 2019-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Dong-Jin
Jin, Fan-Long
Park, Soo-Jin
Text and Data Mining valid from 2019-02-15
Article History
Received: 31 December 2017
Accepted: 12 October 2018
First Online: 15 February 2019