Preparation of copper–silver alloy with different morphologies by a electrodeposition method in 1-butyl-3-methylimidazolium chloride ionic liquid
Crossref DOI link: https://doi.org/10.1007/s12034-019-1928-8
Published Online: 2019-07-10
Published Print: 2019-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Jie, Sun
Ting-Yun, Ming http://orcid.org/0000-0002-9287-3356
Hui-Xuan, Qian
Qi-Song, Li
Text and Data Mining valid from 2019-07-10
Version of Record valid from 2019-07-10
Article History
Received: 3 December 2018
Accepted: 21 May 2019
First Online: 10 July 2019