tert-Butylamine borane as a reductant in electroless nickel plating for improved etch resistance in the electrolyte
Crossref DOI link: https://doi.org/10.1007/s12034-020-02186-4
Published Online: 2020-08-20
Published Print: 2020-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Sollee
Yoon, Sukeun https://orcid.org/0000-0002-2018-9504
Funding for this research was provided by:
Kongju National University (2018-0299-01)
Text and Data Mining valid from 2020-08-20
Version of Record valid from 2020-08-20
Article History
Received: 22 November 2019
Accepted: 13 February 2020
First Online: 20 August 2020