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Effect of Ti addition on the electrochemical behaviour of Sn-0.7Cu-xTi lead-free solders alloys in 3.5 wt.% NaCl solution

Crossref DOI link: https://doi.org/10.1007/s12034-024-03354-6

Published Online: 2024-12-03

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Jaiswal, Dheeraj https://orcid.org/0000-0002-2613-6876
Pathote, Dileep

Singh, Vikrant

Kumar, Mukesh Raushan

Behera, C K
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Text and Data Mining valid from 2024-12-03

Version of Record valid from 2024-12-03
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Article History

Received: 10 April 2024

Accepted: 22 August 2024

First Online: 3 December 2024