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Effect of bonding pressure on microstructure and mechanical properties of aluminium/copper diffusion-bonded joint

Crossref DOI link: https://doi.org/10.1007/s12046-019-1103-3

Published Online: 2019-04-29

Published Print: 2019-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Elsa, M

Khorram, A

Ojo, O O

Paidar, M
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Text and Data Mining valid from 2019-04-29
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Article History

Received: 18 December 2018

Revised: 25 February 2019

Accepted: 27 February 2019

First Online: 29 April 2019