Crossmark

Compact modeling of through silicon vias for thermal analysis in 3-D IC structures

Crossref DOI link: https://doi.org/10.1007/s12046-020-01549-1

Published Online: 2021-02-05

Published Print: 2021-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

PATIL, CHANDRASHEKHAR V https://orcid.org/0000-0003-1476-7467
SUMA, M S
License Information

Text and Data Mining valid from 2021-02-05

Version of Record valid from 2021-02-05
More Information

Article History

Received: 26 November 2019

Revised: 8 October 2020

Accepted: 19 November 2020

First Online: 5 February 2021