Simultaneous optimization of the area, wirelength and TSVs in a 3D IC design
Crossref DOI link: https://doi.org/10.1007/s12046-022-02044-5
Published Online: 2022-12-16
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Prakash, Atul http://orcid.org/0000-0002-4869-8255
Lal, Rajesh Kumar http://orcid.org/0000-0001-7940-9148
Text and Data Mining valid from 2022-12-16
Version of Record valid from 2022-12-16
Article History
Received: 13 September 2022
Revised: 19 October 2022
Accepted: 4 November 2022
First Online: 16 December 2022