Gouda, Rinku Kumar
Srinivasan, G
Umesh, V
Raja, B
Funding for this research was provided by:
DSTSERC (SR/S3/MMER/0005/2014)
Article History
Received: 17 November 2022
Revised: 24 April 2023
Accepted: 16 June 2023
First Online: 27 September 2023
Declarations
:
: On behalf of all authors, I disclose that there is no any actual or potential conflict of interest including any financial, personal or other relationships with other people or organizations during the execution of the works reported in the draft entitled “Surface enhancement for boiling heat transfer through micro holes for electronic cooling applications”