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A novel approach for performance improvements of TSV and TTSV of 3D IC through thermoelectric effect and mechanical reliability analysis

Crossref DOI link: https://doi.org/10.1007/s12046-026-03073-0

Published Online: 2026-03-06

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Chaudhuri, Debika https://orcid.org/0000-0002-9026-3191
Rahaman, Hafizur https://orcid.org/0000-0001-9012-5437
Ghosh, Tamal https://orcid.org/0000-0003-3032-0163
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Text and Data Mining valid from 2026-03-06

Version of Record valid from 2026-03-06
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Article History

Received: 17 November 2024

Revised: 18 April 2025

Accepted: 16 September 2025

First Online: 6 March 2026