Life-Cycle Reliability Evaluation of Semi-Rigid Materials Based on Modulus Degradation Model
Crossref DOI link: https://doi.org/10.1007/s12205-018-0646-x
Published Online: 2018-05-18
Published Print: 2018-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Zhang, Jiupeng
Cui, Shengchao
Cai, Jun
Pei, Jianzhong
Jia, Yanshun
Text and Data Mining valid from 2018-05-18
Article History
Received: 7 June 2017
Revised: 6 March 2018
Accepted: 23 March 2018
First Online: 18 May 2018