Study on crack propagation of adhesively bonded DCB for aluminum foam using energy release rate
Crossref DOI link: https://doi.org/10.1007/s12206-014-1207-y
Published Online: 2015-01-15
Published Print: 2015-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bang, Hyejin
Lee, Sang-kyo
Cho, Chongdu
Cho, Jae Ung
Text and Data Mining valid from 2015-01-01
