Wafer size effect on material removal rate in copper CMP process
Crossref DOI link: https://doi.org/10.1007/s12206-017-0539-9
Published Online: 2017-07-25
Published Print: 2017-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yuh, Minjong
Jang, Soocheon
Park, Inho
Jeong, Haedo
License valid from 2017-06-01
