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Atomistic molecular dynamics simulation study on thermomechanical properties of poly(1,3,5-trimethyl-1,3,5-trivinyl cyclotrisiloxane) dielectric insulator for soft electronics

Crossref DOI link: https://doi.org/10.1007/s12206-018-0427-y

Published Online: 2018-05-15

Published Print: 2018-05

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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