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Chemical mechanical planarization of advanced package substrate by controlling selectivity of copper to polymer

Crossref DOI link: https://doi.org/10.1007/s12206-018-0736-1

Published Online: 2018-08-13

Published Print: 2018-08

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Jang, Soocheon

Yuh, Minjong

Lee, Dasol

Jeong, Seonho

Jeong, Haedo
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Text and Data Mining valid from 2018-08-01
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Article History

Received: 7 March 2018

Revised: 10 April 2018

Accepted: 23 April 2018

First Online: 13 August 2018