Bonding properties on diffusion bonding layer for micro PCD-WC tool fabrication
Crossref DOI link: https://doi.org/10.1007/s12206-019-0717-z
Published Online: 2019-08-01
Published Print: 2019-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Uk-Su
Shin, Seung-Sik
Kim, Ki-Gwon
Jeong, Ba-Wi
Park, Jeong-Woo
Text and Data Mining valid from 2019-08-01
Version of Record valid from 2019-08-01
Article History
Received: 22 August 2018
Revised: 30 January 2019
Accepted: 10 February 2019
First Online: 1 August 2019