Analysis of temperature distribution in the chip-on-glass bonding process
Crossref DOI link: https://doi.org/10.1007/s12206-020-0635-0
Published Online: 2020-07-08
Published Print: 2020-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yun, Won-Soo
Jung, Seung Won
Jin, Songwan
Jeong, Young Hun
Text and Data Mining valid from 2020-07-01
Version of Record valid from 2020-07-01
Article History
Received: 11 February 2020
Revised: 14 May 2020
Accepted: 17 May 2020
First Online: 8 July 2020