Automated visual inspection of particle defect in semiconductor packaging
Crossref DOI link: https://doi.org/10.1007/s12206-024-0740-6
Published Online: 2024-08-03
Published Print: 2024-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Park, Joonsub
Lee, Jeonghoon
Text and Data Mining valid from 2024-08-01
Version of Record valid from 2024-08-01
Article History
Received: 24 January 2024
Revised: 2 April 2024
Accepted: 6 April 2024
First Online: 3 August 2024