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Cooling benefit evaluation of a central processing unit using thermal interface materials with hybrid additives

Published Online: 2024-09-04

Published Print: 2024-09

Authors

Cheng, Chia

Teng, Tun-Ping

Yang, Chii-Rong
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Text and Data Mining valid from 2024-09-01

Version of Record valid from 2024-09-01
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Article History

Received: 23 January 2024

Revised: 6 April 2024

Accepted: 16 May 2024

First Online: 4 September 2024

Conflic of interests

: The authors declare that they have no competing interests.

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