Document is current

Any future updates will be listed below

Computational analysis of warping height in rolled Cu/Al laminates using the symplectic elasticity method

Crossref DOI link: https://doi.org/10.1007/s12206-025-1116-2

Published Online: 2025-12-10

Published Print: 2025-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

About CrossMark