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Creep-rupture durability test and FEA simulation of high temperature solder joints using simple new creep-rupture tester

Published Online: 2025-06-26

Authors

Jeong, Jae-Seong
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Text and Data Mining valid from 2025-06-26

Version of Record valid from 2025-06-26
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Article History

Received: 4 March 2025

Revised: 2 April 2025

Accepted: 25 April 2025

First Online: 26 June 2025

Conflict of interest

: The authors declare no competing interests.

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