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Construction of the Criterion for Using a Two-dimensional Thermal Conductivity Model to Describe the Stress–strain State of a Thin Plate Under the Thermal Shock

Crossref DOI link: https://doi.org/10.1007/s12217-021-09912-5

Published Online: 2021-10-21

Published Print: 2021-12

Update policy: https://doi.org/10.1007/springer_crossmark_policy

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