Mold filling analysis of an alignment structure in micro hot embossing
Crossref DOI link: https://doi.org/10.1007/s12221-014-1197-5
Published Online: 2014-06-01
Published Print: 2014-06
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gomez, Juan A.
Conner, Glenn T.
Chun, Du Hwan
Kim, Yoo-Jae
Song, In-Hyouk
You, Byoung Hee
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