IMC and creep behavior in Lead-free solder joints of Sn-Ag and Sn-Ag-Cu alloy system by SP method
Crossref DOI link: https://doi.org/10.1007/s12239-014-0118-3
Published Online: 2014-11-26
Published Print: 2014-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Z. J.
Yang, S. M.
Yu, H. S.
Kang, S. J.
Song, J. H.
Kim, K. J.
Text and Data Mining valid from 2014-11-26