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Does back cooling improve human thermal comfort in warm environments? A device for heat conduction by the semiconductor Peltier effect

Published Online: 2024-07-04

Published Print: 2024-08

Authors

He, Mengyuan

Liu, Hong

Shao, Lianggen

Li, Baizhan

Wu, Yuxin
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Text and Data Mining valid from 2024-07-04

Version of Record valid from 2024-07-04
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Article History

Received: 25 January 2024

Revised: 18 March 2024

Accepted: 16 April 2024

First Online: 4 July 2024

Declaration of competing interest

: The authors have no competing interests to declare that are relevant to the content of this article.

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