High-precision transfer-printing and integration of vertically oriented semiconductor arrays for flexible device fabrication
Crossref DOI link: https://doi.org/10.1007/s12274-014-0462-7
Published Online: 2014-06-04
Published Print: 2014-07
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Triplett, Mark
Nishimura, Hideki
Ombaba, Matthew
Logeeswarren, V. J.
Yee, Matthew
Polat, Kazim G.
Oh, Jin Y.
Fuyuki, Takashi
Léonard, François
Islam, M. Saif
Text and Data Mining valid from 2014-06-04