Facile ultrafine copper seed-mediated approach for fabricating quasi-two-dimensional palladium-copper bimetallic trigonal hierarchical nanoframes
Crossref DOI link: https://doi.org/10.1007/s12274-017-1487-5
Published Online: 2017-05-06
Published Print: 2017-08
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Shen, Min
Huang, Yuanbiao
Wu, Dongshuang
Lü, Jian
Cao, Minna
Liu, Meimei
Yang, Yinglong
Li, Hongfang
Guo, Binbin
Cao, Rong
License valid from 2017-05-06