Promising electroplating solution for facile fabrication of Cu quantum point contacts
Crossref DOI link: https://doi.org/10.1007/s12274-017-1544-0
Published Online: 2017-06-03
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yang, Yang
Liu, Junyang
Zheng, Jueting
Lu, Miao
Shi, Jia
Hong, Wenjing
Yang, Fangzu
Tian, Zhongqun
License valid from 2017-06-03