Avoiding heating interference and guided thermal conduction in stretchable devices using thermal conductive composite islands
Crossref DOI link: https://doi.org/10.1007/s12274-021-3400-5
Published Online: 2021-03-18
Published Print: 2021-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kang, Seung Ji
Hong, Haeleen
Jeong, Chanho
Lee, Ju Seung
Ryu, Hyewon
Yang, Jae-hun
Kim, Jong Uk
Shin, Yiel Jae
Kim, Tae-il
Text and Data Mining valid from 2021-03-18
Version of Record valid from 2021-03-18
Article History
Received: 4 December 2020
Revised: 5 February 2021
Accepted: 10 February 2021
First Online: 18 March 2021