Intelligent structured nanocomposite adhesive for bioelectronics and soft robots
Crossref DOI link: https://doi.org/10.1007/s12274-023-6016-0
Published Online: 2023-08-29
Published Print: 2024-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Yeon Soo
Kim, Min-Seok
Kim, Da Wan
Pang, Changhyun
Text and Data Mining valid from 2023-08-29
Version of Record valid from 2023-08-29
Article History
Received: 12 May 2023
Revised: 17 July 2023
Accepted: 18 July 2023
First Online: 29 August 2023