Silicon-processes-compatible contact engineering for two-dimensional materials integrated circuits
Crossref DOI link: https://doi.org/10.1007/s12274-023-6167-z
Published Online: 2023-10-27
Published Print: 2023-11
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Gao, Li
Chen, Zhangyi
Chen, Chao
Zhang, Xiankun
Zhang, Zheng
Zhang, Yue
Text and Data Mining valid from 2023-10-27
Version of Record valid from 2023-10-27
Article History
Received: 11 August 2023
Revised: 4 September 2023
Accepted: 4 September 2023
First Online: 27 October 2023