High strain rate embossing with copper plate
Crossref DOI link: https://doi.org/10.1007/s12289-016-1312-9
Published Online: 2016-08-11
Published Print: 2017-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Wang, Huimin
Vivek, Anupam
Wang, Yuliang
Viswanathan, Gopal
Daehn, Glenn
Funding for this research was provided by:
Alcoa Foundation
License valid from 2016-08-11