A multi-granularity approach for estimating the sustainability of a factory simulation model: semiconductor packaging as an example
Crossref DOI link: https://doi.org/10.1007/s12351-017-0342-5
Published Online: 2017-08-21
Published Print: 2018-10
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Chen, Toly
Wang, Li-Chih
Chiu, Min-Chi http://orcid.org/0000-0001-6938-2391
Text and Data Mining valid from 2017-08-21
