Die-attach for power devices using the Ag sintering process: Interfacial microstructure and mechanical strength
Crossref DOI link: https://doi.org/10.1007/s12540-017-6908-1
Published Online: 2017-09-07
Published Print: 2017-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Byung-Suk
Yoon, Jeong-Won
License valid from 2017-09-01