Effect of the Deformation State on the Mechanical Degradation of Cu Metal Films on Flexible PI Substrates During Cyclic Sliding Testing
Crossref DOI link: https://doi.org/10.1007/s12540-018-0155-y
Published Online: 2018-06-14
Published Print: 2019-01
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Bag, Atanu
Park, Ki-Seong
Choi, Shi-Hoon
Text and Data Mining valid from 2018-06-14
Article History
Received: 27 April 2018
Accepted: 31 May 2018
First Online: 14 June 2018