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Thermal Ageing Studies of Sintered Micron-Silver (Ag) Joint as a Lead-Free Bonding Material

Published Online: 2019-07-30

Published Print: 2020-09

Authors

Siow, K. S. https://orcid.org/0000-0003-2519-780X
Chua, S. T.
Funding

Funding for this research was provided by:

Universiti Kebangsaan Malaysia (GUP-2018-126, GGPM-2013-079)
License Information

Text and Data Mining valid from 2019-07-30

Version of Record valid from 2019-07-30
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Article History

Received: 8 March 2019

Accepted: 21 July 2019

First Online: 30 July 2019

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