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Fabrication of Cu Particles with Porous Surface and Enhanced Sinter-Bondability between Cu Finishes by Physically In Situ Formation of Cu Nanoparticles Using Them

Crossref DOI link: https://doi.org/10.1007/s12540-024-01790-x

Published Online: 2024-09-09

Published Print: 2025-04

Update policy: https://doi.org/10.1007/springer_crossmark_policy

Authors

Han, Byeong Jo

Lee, Jong-Hyun https://orcid.org/0000-0002-3792-0404
Funding

Funding for this research was provided by:

Ministry of Science and ICT, South Korea (2021R1A2C1007400)

Ministry of Trade, Industry and Energy (P0008458)
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Article History

Received: 27 May 2024

Accepted: 9 August 2024

First Online: 9 September 2024

Declarations

:

: The authors have no relevant financial or non-financial interests to disclose.

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