Degradation characteristics and Ni3Sn4 IMC growth by a thermal shock test in SAC305 solder joints of MLCCs applied in automotive electronics
Crossref DOI link: https://doi.org/10.1007/s12541-016-0055-3
Published Online: 2016-04-16
Published Print: 2016-04
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kang, Min-Soo
Jeon, Yu-Jae
Kim, Do-Seok
Shin, Young-Eui
Text and Data Mining valid from 2016-04-01