Minimization of warpage for wafer level package using response surface method
Crossref DOI link: https://doi.org/10.1007/s12541-016-0144-3
Published Online: 2016-09-10
Published Print: 2016-09
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Lee, Hye-Jin
Park, Sun-Myoung
Park, Sung-Jun
License valid from 2016-09-01