Polishing Characteristics of MnO2 Polishing Slurry on the Si-face of SiC Wafer
Crossref DOI link: https://doi.org/10.1007/s12541-018-0206-9
Published Online: 2018-11-26
Published Print: 2018-12
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Yin, Tao http://orcid.org/0000-0001-7696-6694
Doi, Tosiro
Kurokawa, Syuhei
Zhou, Zhao zhong
Feng, Kai ping
Text and Data Mining valid from 2018-11-26
Article History
Received: 11 June 2018
Revised: 29 August 2018
Accepted: 4 October 2018
First Online: 26 November 2018