Multilayer Fabrication of Micromolding and Electroforming with the Planarization of Grinding for High-Aspect-Ratio Microelectrodes in Electro-conjugate Fluid (ECF) Micropumps
Crossref DOI link: https://doi.org/10.1007/s12541-019-00299-3
Published Online: 2020-01-19
Published Print: 2020-05
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Han, Dong
Yamada, Yoshiho
Yokota, Shinichi
Kim, Joon-wan http://orcid.org/0000-0001-7273-5055
Funding for this research was provided by:
Japan Society for the Promotion of Science (18H01359)
Text and Data Mining valid from 2020-01-19
Version of Record valid from 2020-01-19
Article History
Received: 4 August 2019
Revised: 3 December 2019
Accepted: 12 December 2019
First Online: 19 January 2020