Development of a TPU/CNT/Cu Composite Conductive Filament with a High CNT Concentration
Crossref DOI link: https://doi.org/10.1007/s12541-022-00712-4
Published Online: 2022-10-18
Published Print: 2023-02
Update policy: https://doi.org/10.1007/springer_crossmark_policy
Kim, Hansol
Yoo, Hojin
Shin, Seungcheol
Cho, Jungho http://orcid.org/0000-0003-2165-2692
Han, Sang-Woo
Lee, Inhwan
Text and Data Mining valid from 2022-10-18
Version of Record valid from 2022-10-18
Article History
Received: 26 April 2022
Revised: 22 August 2022
Accepted: 23 August 2022
First Online: 18 October 2022